PCB Fabrication Capability

       Base Material: FR4, Tg130/ Tg170, CEM1, Rogers, Metal base board, Flex PCB etc
       Min/Max Number of Layers: 1 to 38 layers
       Max Dimension of Board: 23inchX35inch
       Min/Max Final Thickness Board: 0.21-8.0mm
       Copper Foil Thickness: 0.5 OZ to 10 OZ
       Finished Surface: HASL, Flash Gold, Immersion Gold, Immersion Silver, Immersion Tin, OSP etc
       Impedance control: +/- 5%
       Solder Mask (colors): Green, Red, Yellow, White, Black, Blue etc 
       Min Soldermask Width: 4mil
       Min Soldermask opening: 1.5mil
       Silkscreen (min line width): 4mil
       Silkscreen (colors): White, Black, Yellow etc
       Mini Line Width / Space: 3mil
       Min Drilling Hole: 0.10mm
       Min Finished Hole Size / for Thickness Board: 01:12.5
       Minimum Annular Ring 12mil
       Via hole type:  Buried, blind
       Contour type: CNC rout, Punch, V-score
       V-score depth / for Min Thickness Board: 1/3 for the board
       Min. distance of trace to V-skore: 0.075mm
       Min. Slot Width: 0.075mm

PCB Assembly Capability

       SMT from 0201 and Through Hole
       One-sided as well as double-sided, muti-layers PCB assembly
       Simple to very complex AND Flex PCB assemblies
       Capability to handle any device include all types of BGAs, QFNs, DFNs, CSPs & Flip Chip etc 
       Small quantities and quick turns available
       Consigned Components or PCB Turnkey services 
       RoHS & Lead-Free Assembly
       BGA and Micro BGAs Placement and Reflow, X-Ray equipment available 
       Automated Optical Inspection (AOI)
       In-circuit and Functional Tests (ICT & FCT)