PCB Fabrication Capability
Base Material: FR4, Tg130/ Tg170, CEM1, Rogers, Metal base board, Flex PCB etc
Min/Max Number of Layers: 1 to 38 layers
Max Dimension of Board: 23inchX35inch
Min/Max Final Thickness Board: 0.21-8.0mm
Copper Foil Thickness: 0.5 OZ to 10 OZ
Finished Surface: HASL, Flash Gold, Immersion Gold, Immersion Silver, Immersion Tin, OSP etc
Impedance control: +/- 5%
Solder Mask (colors): Green, Red, Yellow, White, Black, Blue etc
Min Soldermask Width: 4mil
Min Soldermask opening: 1.5mil
Silkscreen (min line width): 4mil
Silkscreen (colors): White, Black, Yellow etc
Mini Line Width / Space: 3mil
Min Drilling Hole: 0.10mm
Min Finished Hole Size / for Thickness Board: 01:12.5
Minimum Annular Ring 12mil
Via hole type: Buried, blind
Contour type: CNC rout, Punch, V-score
V-score depth / for Min Thickness Board: 1/3 for the board
Min. distance of trace to V-skore: 0.075mm
Min. Slot Width: 0.075mm
PCB Assembly Capability
SMT from 0201 and Through Hole
One-sided as well as double-sided, muti-layers PCB assembly
Simple to very complex AND Flex PCB assemblies
Capability to handle any device include all types of BGAs, QFNs, DFNs, CSPs & Flip Chip etc
Small quantities and quick turns available
Consigned Components or PCB Turnkey services
RoHS & Lead-Free Assembly
BGA and Micro BGAs Placement and Reflow, X-Ray equipment available
Automated Optical Inspection (AOI)
In-circuit and Functional Tests (ICT & FCT) |